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ESTEE Masking Tape is a custom die-cut process material applied to designated areas of the semiconductor package that must remain free of metal deposition. Unmasked areas remain exposed during sputtering, creating the required selective EMI shielding coating.
The solution is particularly suitable for double-sided molded packages, as well as packages with solder balls, bumps, components or stepped topography.
Material construction, adhesive performance and die-cut geometry are engineered around the package drawing, mask/deposition boundary, surface topography, equipment interface and sputtering conditions.
ESTEE EMI Sputter PI Ring Tape is a polyimide-based process carrier designed for EMI shielding applications in SiP (System-in-Package) manufacturing. Singulated packages are mounted onto the PI tape, leaving the top surface and sidewalls exposed for metal deposition while the bottom surface remains protected. After the sputtering process is completed, the packages are released using lift pins.
Two configurations are available: direct-mount and high adhesion for assemblies using UV Pre Tape.
ESTEE UV Dicing Tape is designed for the dicing and singulation of wafers, glass, substrates and other workpieces. Before UV exposure, the tape securely holds the wafer or workpiece on a ring frame to help suppress movement, die flying, and abnormal vibration. After dicing, UV exposure cures the adhesive and sharply reduces adhesion, supporting low-stress manual and automated pickup while reducing pickup stress, chipping, and residue risk.
ESTEE provides a precision-device and chip handling and transport solution combining a Grip Ring (Wafer Expander Ring), a protective shipping box and antistatic blue film. The film secures the wafer and singulated die through dicing, expansion and transportation; the ring tensions the film to establish controlled die spacing; and the shipping box locates and protects the loaded ring during storage and shipment.
ESTEE Waffle Packs are precision injection-molded carriers developed for COC optoelectronic chips, die, optical devices, and other miniature precision components. Each device is held in an individual pocket to reduce contact, collision, rotation, and migration during handling, storage, and transportation, while supporting manual handling and automated pick-and-place workflows.
The ESTEE Glue Box is a pocketless carrier with a transparent elastomer layer applied directly to the box base. The continuous support surface securely holds delicate components during storage, shipment, inspection and processing, whilst accommodating both manual handling with tweezers and direct handling by automated pick-and-place equipment.