Menu
ESTEE Waffle Packs are precision injection-molded carriers developed for COC optoelectronic chips, die, optical devices, and other miniature precision components. Each device is held in an individual pocket to reduce contact, collision, rotation, and migration during handling, storage, and transportation, while supporting manual handling and automated pick-and-place workflows.
|
Parameter |
Typical Value |
|
Product Size |
2-inch, 4-inch |
|
Pocket design |
Custom-engineered from device drawings and handling requirements |
|
Pocket dimensional control |
±0.05mm; Minimum ±0.02 mm |
|
Pocket surface roughness |
Ra < 0.32 µm; Minimum＜0.1 µm |
|
Material options |
PC, ABS, PP |
|
Surface resistance |
10⁴–10⁹ Ω/sq |
|
Parameter |
Typical Value |
|
Product Size |
2-inch, 4-inch |
|
Pocket design |
Custom-engineered from device drawings and handling requirements |
|
Pocket dimensional control |
±0.05mm; Minimum ±0.02 mm |
|
Pocket surface roughness |
Ra < 0.32 µm; Minimum＜0.1 µm |
|
Material options |
PC, ABS, PP |
|
Surface resistance |
10⁴–10⁹ Ω/sq |
Customized Protective Design
Custom pocket and lid-restraint designs limit device movement while maintaining clearance from bond wires, mounted components, optical surfaces, electrodes, and other contact-sensitive features.
Controlled Contact Surface
Device-contact surface roughness is precisely controlled to reduce friction and minimize the risk of abrasion, scratching, and other contact-related damage.
High-Cleanliness Manufacturing
Packs are injection-molded in a cleanroom and undergo a strict automated cleaning process, providing a high level of cleanliness while minimizing particle, residue, and contamination risks.
End-to-End Custom Engineering
Engineering support spans requirement analysis, customized design, tooling, sampling, validation, and volume production.
CoC & CoS Laser Assemblies
DFB · EML · VCSEL · External light sources
Optoelectronic & PIC Dies
Laser · PIN/APD · Modulator · Silicon photonics · InP photonics
Ceramic Components
AlN submount · Ceramic substrates · Ceramic carriers
Semiconductor Dies
Analog IC · Mixed-signal IC · Diode · Transistor
RF & Microwave Dies
GaAs/GaN MMIC · RF switch · Power amplifier
|
Stage |
Customer Input / Action |
ESTEE Deliverable |
|
1. Requirement Input |
Provide 2D/3D device drawings, sensitive and no-contact areas, critical dimensions and tolerances, handling method, ESD and cleanliness requirements. |
Confirmed requirements, protection priorities and acceptance targets. |
|
2. Engineering Design |
\ |
Recommended material and ESD configuration; pocket geometry, array layout, datum, pickup access, keep-out zones and top-restraint design. |
|
3. Sample Validation |
Evaluate engineering samples with actual devices and the intended loading, inspection, transport and unloading processes; valid fit, movement, protection and pickup performance. |
Engineering drawing, sample set, validation guidance and any required design adjustment. |
|
4. Pilot and Mass Production |
Approve the drawing/specification, sample configuration and acceptance criteria. |
Tooling, pilot production, issue closure, production inspection plan and controlled transition to mass production. |
Two Construction Options
|
Option |
Construction |
Customer Value |
|
Separate Tray and Lid |
Device pockets are formed on the tray, with a separate lid providing customized clearance, restraint, and protection for sensitive areas |
Maximum flexibility to optimize device height, vertical clearance and protection. |
|
Integrated Tray and Lid |
Each molded component combines device pockets on one side with matching restraint features on the reverse, allowing identical components to stack securely and limit device movement. |
Reduces separate tray/lid inventory and simplifies matching, handling and assembly. |
ESTEE provides a precision-device and chip handling and transport solution combining a Grip Ring (Wafer Expander Ring), a protective shipping box and antistatic blue film. The film secures the wafer and singulated die through dicing, expansion and transportation; the ring tensions the film to establish controlled die spacing; and the shipping box locates and protects the loaded ring during storage and shipment.
The ESTEE Glue Box is a pocketless carrier with a transparent elastomer layer applied directly to the box base. The continuous support surface securely holds delicate components during storage, shipment, inspection and processing, whilst accommodating both manual handling with tweezers and direct handling by automated pick-and-place equipment.
The ESTEE VR Vacuum Release Tray is constructed with a special transparent polymer film supported by a precision mesh. In the normal holding state, devices remain attached to the film during handling, inspection, storage and transportation. When vacuum is applied beneath the tray, the film conforms to the mesh and the holding force decreases rapidly, enabling easy removal by manual and automated pick-and-place equipment.