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The ESTEE Glue Box is a pocketless carrier with a transparent elastomer layer applied directly to the box base. The continuous support surface securely holds delicate components during storage, shipment, inspection and processing, whilst accommodating both manual handling with tweezers and direct handling by automated pick-and-place equipment.
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Parameter |
Typical Value |
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Size |
50 x 50, 80 x 80, 120 x 90, 120 x 120 mm |
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Grid printing |
1010A, 1010B, 0610A |
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Elastomer series |
Silicone / silicone-free |
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Silicone adhesion level |
G0, G1, G3, G5, G8, G12, G20, G30 |
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Silicone-free adhesion level |
L0, L1, L2, L3, L5, L6, L7 |
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Adhesion Level |
Standard Grade |
Application Guidance |
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Ultra-low |
G0, G1 / L0 |
Ultra-thin, very light, polished, or release-sensitive devices |
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Low |
G3, G5 / L1, L2 |
Small optical components, bare die, or flat-surface devices |
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Medium |
G8, G12 / L3, L5 |
Lightly textured or moderately heavy components |
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High |
G20, G30 / L6, L7 |
Heavier or rough-surface components |
|
Parameter |
Typical Value |
|
Size |
50 x 50, 80 x 80, 120 x 90, 120 x 120 mm |
|
Grid printing |
1010A, 1010B, 0610A |
|
Elastomer series |
Silicone / silicone-free |
|
Silicone adhesion level |
G0, G1, G3, G5, G8, G12, G20, G30 |
|
Silicone-free adhesion level |
L0, L1, L2, L3, L5, L6, L7 |
|
Adhesion Level |
Standard Grade |
Application Guidance |
|
Ultra-low |
G0, G1 / L0 |
Ultra-thin, very light, polished, or release-sensitive devices |
|
Low |
G3, G5 / L1, L2 |
Small optical components, bare die, or flat-surface devices |
|
Medium |
G8, G12 / L3, L5 |
Lightly textured or moderately heavy components |
|
High |
G20, G30 / L6, L7 |
Heavier or rough-surface components |
Universal Pocketless Design
The continuous retention surface accommodates multiple component sizes without contacting device top surfaces or edges.
Clear Visibility and Positioning
The transparent elastomer and printed reference grid enable accurate placement, counting, and visual inspection across the usable area.
Flexible Material Options
Silicone and silicone-free platforms support both general applications and silicone-restricted processes.
Application-Specific Customization
Box dimensions, color, grid pattern, ESD performance, and adhesion grade can be tailored to specific device and handling requirements.
End-to-End In-House Manufacturing
Injection molding, adhesive formulation, and automated dispensing are performed entirely in-house, ensuring
tight process control, reliable product performance, and rapid response to customer requirements.
Optical Components
Precision glass bars · Optical filter bars · Lenses · Filters · Prisms · Waveguides
Optoelectronic & Semiconductor Devices
Laser dies · Photodiodes · Photonic dies · IC dies · MEMS · Sensors
Ceramic Components
Ceramic substrates · Submounts · Spacers · Insulating components
Medical & Other Precision Devices
Medical micro-components · Thin, fragile, irregular, or high-value devices
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Stage |
Customer Input / Action |
ESTEE Deliverable |
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1. Requirement Input |
Provide device material, dimensions, weight, contact area and surface condition; specify the handling method, box size, grid, ESD and silicone restrictions. |
Confirmed requirements for secure holding, clean release, cleanliness, ESD control and equipment compatibility. |
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2. Engineering Recommendation |
\ |
Recommended elastomer series, public adhesion level, box size and structure, color, grid pattern and ESD configuration. |
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3. Sample Validation |
Evaluate representative samples with actual devices and the intended loading, transport, storage and removal process; verify the effectiveness of holding, release and handling. |
Sample set, validation guidance and any necessary adjustment to elastomer series, adhesion level or box configuration. |
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4. Pilot and Mass Production |
Approve the validated configuration, drawing/specification and acceptance criteria. |
Small-batch pilot production, issue closure and controlled transition to mass production. |
● Select by the actual device. Retention depends on device weight, contact area, surface finish, cleanliness, and process conditions. Confirm the final grade using representative samples.
● Load devices onto a clean, dry surface. Place components vertically and avoid sliding them across the elastomer.
● Remove devices with controlled force. Lift vertically using suitable tweezers, tooling, or pick-and-place equipment to minimize shear stress.
● Protect the retention surface. Keep the lid closed when not in use, and prevent dust, oil, and sharp objects from contacting the elastomer. 
ESTEE provides a precision-device and chip handling and transport solution combining a Grip Ring (Wafer Expander Ring), a protective shipping box and antistatic blue film. The film secures the wafer and singulated die through dicing, expansion and transportation; the ring tensions the film to establish controlled die spacing; and the shipping box locates and protects the loaded ring during storage and shipment.
ESTEE Waffle Packs are precision injection-molded carriers developed for COC optoelectronic chips, die, optical devices, and other miniature precision components. Each device is held in an individual pocket to reduce contact, collision, rotation, and migration during handling, storage, and transportation, while supporting manual handling and automated pick-and-place workflows.
The ESTEE VR Vacuum Release Tray is constructed with a special transparent polymer film supported by a precision mesh. In the normal holding state, devices remain attached to the film during handling, inspection, storage and transportation. When vacuum is applied beneath the tray, the film conforms to the mesh and the holding force decreases rapidly, enabling easy removal by manual and automated pick-and-place equipment.