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ESTEE EMI Sputter PI Ring Tape is a polyimide-based process carrier designed for EMI shielding applications in SiP (System-in-Package) manufacturing. Singulated packages are mounted onto the PI tape, leaving the top surface and sidewalls exposed for metal deposition while the bottom surface remains protected. After the sputtering process is completed, the packages are released using lift pins.
Two configurations are available: direct-mount and high adhesion for assemblies using UV Pre Tape.
Two Application Configurations
|
Configuration |
Mounting Method |
Release Logic |
|
Direct mounting |
Mount the package directly onto the PI tape. |
Balance sputter-process holding force with controlled lift-pin release. |
|
With UV Pre Tape |
Mount the UV pre-tape/package assembly onto the PI tape. |
The PI Tape holds the UV Pre Tape during pin lifting, enabling the package to detach. |
Configuration 1: Direct Mounting
Packages are mounted directly on the PI Tape. The tape holds the package during sputtering.
|
Process Requirement |
Product Function |
|
Surface protection |
Contacts and protects the bottom side while helping control overflow. |
|
Stable holding |
Controlled adhesion helps limit package movement or lifting during vacuum, handling and sputtering. |
|
Controlled pin lifting |
Balances process holding force with lift-pin release to support reliable unloading. |
|
Boundary and appearance |
Validates overflow, residue, particles, edge burr and PAD discoloration against customer criteria. |
Representative Models
|
Product Grade |
Base Film Thickness (μm) |
Adhesive Thickness (μm) |
180° Peel Adhesion (gf/inch) |
|
SP612-95PI700L |
75 |
20 |
700 |
|
SP612-70PI350L |
50 |
20 |
350 |
Configuration 2: With UV Pre Tape
Packages are first attached to UV Pre Tape. The UV Pre Tape/package assembly is then mounted onto the PI Tape for sputtering. During pin-lift unloading, the PI Tape holds the UV Pre Tape during pin lifting, enabling the package to detach.
|
Process Requirement |
Product Function |
|
High flatness |
Minimizes local gaps and provides a stable mounting surface for the UV pre-tape/package assembly. |
|
High holding force |
Keeps the assembly stable during vacuum, handling and sputtering. |
|
Reliable separation |
Retains the UV Pre Tape during pin lifting, allowing the package to detach without lifting the tape. |
Representative Models
|
Product Grade |
Base Film (μm) |
Adhesive Thickness (μm) |
180° Peel Adhesion (gf/inch) |
|
SP612-RT-105PI1200L |
75 |
30 |
1,200 |
|
SP612-RT-135PI1800L |
75 |
60 |
1,800 |
Two Application Configurations
|
Configuration |
Mounting Method |
Release Logic |
|
Direct mounting |
Mount the package directly onto the PI tape. |
Balance sputter-process holding force with controlled lift-pin release. |
|
With UV Pre Tape |
Mount the UV pre-tape/package assembly onto the PI tape. |
The PI Tape holds the UV Pre Tape during pin lifting, enabling the package to detach. |
Configuration 1: Direct Mounting
Packages are mounted directly on the PI Tape. The tape holds the package during sputtering.
|
Process Requirement |
Product Function |
|
Surface protection |
Contacts and protects the bottom side while helping control overflow. |
|
Stable holding |
Controlled adhesion helps limit package movement or lifting during vacuum, handling and sputtering. |
|
Controlled pin lifting |
Balances process holding force with lift-pin release to support reliable unloading. |
|
Boundary and appearance |
Validates overflow, residue, particles, edge burr and PAD discoloration against customer criteria. |
Representative Models
|
Product Grade |
Base Film Thickness (μm) |
Adhesive Thickness (μm) |
180° Peel Adhesion (gf/inch) |
|
SP612-95PI700L |
75 |
20 |
700 |
|
SP612-70PI350L |
50 |
20 |
350 |
Configuration 2: With UV Pre Tape
Packages are first attached to UV Pre Tape. The UV Pre Tape/package assembly is then mounted onto the PI Tape for sputtering. During pin-lift unloading, the PI Tape holds the UV Pre Tape during pin lifting, enabling the package to detach.
|
Process Requirement |
Product Function |
|
High flatness |
Minimizes local gaps and provides a stable mounting surface for the UV pre-tape/package assembly. |
|
High holding force |
Keeps the assembly stable during vacuum, handling and sputtering. |
|
Reliable separation |
Retains the UV Pre Tape during pin lifting, allowing the package to detach without lifting the tape. |
Representative Models
|
Product Grade |
Base Film (μm) |
Adhesive Thickness (μm) |
180° Peel Adhesion (gf/inch) |
|
SP612-RT-105PI1200L |
75 |
30 |
1,200 |
|
SP612-RT-135PI1800L |
75 |
60 |
1,800 |
Balanced Process Performance
By optimizing the adhesive layer’s composition, structure, thickness, and adhesive strength, the PI tape effectively controls overflow, adhesive residue, burrs, and sidewall coating defects.
Excellent ESD Performance
Reliable electrostatic-dissipative performance helps reduce the risk of electrostatic damage during mounting, handling, sputtering and unloading.
High-Temperature and Low-Outgassing
The PI base film and low-outgassing adhesive system support high-temperature and vacuum sputtering environments, reducing contamination risks to devices and process chambers.
Highly Customizable
Tape construction, adhesive thickness, adhesion, outline and unit layout can be customized to chip dimensions and type, PAD or solder-ball geometry, equipment interfaces, carrier plates, lift-pin paths and unloading methods, helping reduce process complexity and improve process stability.
Direct Mounting of LGA/QFN Packages
Suitable for LGA, QFN and other packages with relatively flat surfaces. The PAD or terminal side is mounted directly onto the PI Tape for stable holding and bottom-side protection during EMI sputtering, followed by lift-pin release and unloading.
BGA Packages Used with UV Pre Tape
BGA packages are not mounted directly onto the PI Tape. The packages are first attached to UV Pre Tape, and the UV Pre Tape/package assembly is then mounted onto the PI Tape for EMI sputtering. During pin-lift unloading, the PI carrier retains the UV Pre Tape, allowing the BGA packages to separate reliably.
|
Stage |
Customer Input / Action |
ESTEE Deliverable |
|
1. Requirement Input |
Provide package drawing, unit layout and pitch, frame size, alignment method, sputter conditions, unloading method and ESD requirements. |
Confirmed process conditions, protection priorities and acceptance targets. |
|
2. Engineering Recommendation |
\ |
Recommended adhesive layer structure, thickness, adhesion, product drawings and instructions for use. |
|
3. Sample Validation |
Evaluate mounting, handling, vacuum, sputtering and unloading with actual packages; verify flatness, retention, separation, overflow, residue, particles, burr and appearance. |
Sample set, validation guidance and required adjustments to the material, adhesion, geometry or process window. |
|
4. Pilot and Mass Production |
Approve the validated grade, drawing or specification, test methods and acceptance criteria. |
Pilot production, issue closure, production inspection plan and controlled transition to mass production. |
Process Flow
|
Configuration |
Typical Process Flow |
|
Direct mounting |
Mount package bottom side on PI Tape → Sputter → Lift-pin release → Unload |
|
With UV Pre Tape |
Attach package to UV Pre Tape → Saw → Mount on PI Tape→ Sputter → Pin lift → PI carrier retains UV Pre Tape → Unload |
