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ESTEE Masking Tape is a custom die-cut process material applied to designated areas of the semiconductor package that must remain free of metal deposition. Unmasked areas remain exposed during sputtering, creating the required selective EMI shielding coating.
The solution is particularly suitable for double-sided molded packages, as well as packages with solder balls, bumps, components or stepped topography.
Material construction, adhesive performance and die-cut geometry are engineered around the package drawing, mask/deposition boundary, surface topography, equipment interface and sputtering conditions.
ESTEE EMI Sputter PI Ring Tape is a polyimide-based process carrier designed for EMI shielding applications in SiP (System-in-Package) manufacturing. Singulated packages are mounted onto the PI tape, leaving the top surface and sidewalls exposed for metal deposition while the bottom surface remains protected. After the sputtering process is completed, the packages are released using lift pins.
Two configurations are available: direct-mount and high adhesion for assemblies using UV Pre Tape.