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ESTEE provides a precision-device and chip handling and transport solution combining a Grip Ring (Wafer Expander Ring), a protective shipping box and antistatic blue film. The film secures the wafer and singulated die through dicing, expansion and transportation; the ring tensions the film to establish controlled die spacing; and the shipping box locates and protects the loaded ring during storage and shipment.
|
Product Module |
Parameter |
Typical Value |
|
Antistatic Blue Film |
Dimension |
230mm, 300mm |
|
Construction |
Base film with adhesive layer |
|
|
Adhesion |
60gf/inch, 150gf/inch |
|
|
Surface resistance |
104-109Ω/sq |
|
|
Grip Ring (Wafer Expander Ring) |
Dimension |
6-inch, 8-inch |
|
Construction |
Inner ring, Outer ring |
|
|
Film compatibility |
PO, PVC and other expansion films |
|
|
Material |
High-strength and fatigue-resistant polymer |
|
|
Surface resistance |
104-109Ω/sq |
|
|
Shipping Box |
Dimension |
6-inch, 8-inch |
|
Forming process |
Injection molding, Thermoforming |
|
|
Material |
PC, PET, PS |
|
|
Surface resistance |
104-109Ω/sq |
|
Product Module |
Parameter |
Typical Value |
|
Antistatic Blue Film |
Dimension |
230mm, 300mm |
|
Construction |
Base film with adhesive layer |
|
|
Adhesion |
60gf/inch, 150gf/inch |
|
|
Surface resistance |
104-109Ω/sq |
|
|
Grip Ring (Wafer Expander Ring) |
Dimension |
6-inch, 8-inch |
|
Construction |
Inner ring, Outer ring |
|
|
Film compatibility |
PO, PVC and other expansion films |
|
|
Material |
High-strength and fatigue-resistant polymer |
|
|
Surface resistance |
104-109Ω/sq |
|
|
Shipping Box |
Dimension |
6-inch, 8-inch |
|
Forming process |
Injection molding, Thermoforming |
|
|
Material |
PC, PET, PS |
|
|
Surface resistance |
104-109Ω/sq |
Integrated Ring–Film Design
Ring fit, insertion force, clamping geometry, and film tension are engineered together to reduce film-breakage risk.
Reusable Structural Stability
High-strength, fatigue-resistant ring materials maintain dimensional accuracy and clamping stability through repeated use.
Application-Matched Film Performance
Film adhesion, thickness, and substrate are selected to meet specific device, expansion, transport, and pickup requirements.
High-Cleanliness Packaging
The film, grip ring, and shipper are manufactured in the cleanroom, with the ring and shipper additionally undergoing dedicated automated cleaning to meet stringent packaging cleanliness requirements.
System-Level ESD Protection
ESD performance is engineered across the film, ring, and shipper to provide coordinated electrostatic protection throughout handling, storage, and transport.
Wafer Expansion & Die Sorting
Supports post-dicing expansion and sorting of silicon, silicon photonics, compound semiconductor, MEMS, and sensor wafers. Uniform film stretching creates consistent die spacing for efficient inspection, sorting, and pick-and-place.
Device Storage & Transportation
Provides reliable support for wafers, modules, substrates, glass components, and other miniature precision devices during storage, in-process transfer, and transportation.
|
Stage |
Customer Input / Action |
ESTEE Deliverable |
|
1. Requirement Input |
Provide wafer or device dimensions, film material and thickness, pickup method, loading condition, ESD requirements. |
Confirmed requirements, interface conditions, protection priorities and acceptance targets. |
|
2. Engineering Configuration |
\ |
Recommended Grip Ring geometry; blue-film thickness, adhesion and ESD configuration; and shipping-box construction, locating features, color and stacking design. |
|
3. Sample Validation |
Evaluate samples with actual wafers or devices through clamping, expansion, handling, transport and pickup; verify fit, tension, retention, release and protection. |
Sample set, validation guidance and any required adjustment to ring fit, film specification or box construction. |
|
4. Pilot and Mass Production |
Approve the validated configuration, drawing or specification, test method and acceptance criteria. |
Pilot production, issue closure, production inspection plan and controlled transition to mass production. |
How the System Works
● Antistatic Blue Film — Provides a continuous carrier surface and controlled adhesion to retain wafers or singulated die during dicing, expansion, handling and transport.
● Grip Ring — Precision-matched inner and outer rings clamp and tension the film, establishing controlled die spacing and a stable handling interface.
● Shipping Box — Ring-matched locating and restraint features limit movement and protect the loaded ring from impact, compression, scratching and contamination.
ESTEE Waffle Packs are precision injection-molded carriers developed for COC optoelectronic chips, die, optical devices, and other miniature precision components. Each device is held in an individual pocket to reduce contact, collision, rotation, and migration during handling, storage, and transportation, while supporting manual handling and automated pick-and-place workflows.
The ESTEE Glue Box is a pocketless carrier with a transparent elastomer layer applied directly to the box base. The continuous support surface securely holds delicate components during storage, shipment, inspection and processing, whilst accommodating both manual handling with tweezers and direct handling by automated pick-and-place equipment.
The ESTEE VR Vacuum Release Tray is constructed with a special transparent polymer film supported by a precision mesh. In the normal holding state, devices remain attached to the film during handling, inspection, storage and transportation. When vacuum is applied beneath the tray, the film conforms to the mesh and the holding force decreases rapidly, enabling easy removal by manual and automated pick-and-place equipment.