ESTEE UV Dicing Tape is designed for the dicing and singulation of wafers, glass, substrates and other workpieces. Before UV exposure, the tape securely holds the wafer or workpiece on a ring frame to help suppress movement, die flying, and abnormal vibration. After dicing, UV exposure cures the adhesive and sharply reduces adhesion, supporting low-stress manual and automated pickup while reducing pickup stress, chipping, and residue risk.
