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The ESTEE VR Vacuum Release Tray is constructed with a special transparent polymer film supported by a precision mesh. In the normal holding state, devices remain attached to the film during handling, inspection, storage and transportation. When vacuum is applied beneath the tray, the film conforms to the mesh and the holding force decreases rapidly, enabling easy removal by manual and automated pick-and-place equipment.
|
Parameter |
Typical Value |
|
Tray size |
2-inch, 4-inch, 6-inch |
|
Mesh |
15, 36, 74, 100, 135, 195 |
|
Grid printing |
1010A, 2020A, 0215A |
|
Adhesion level |
GL, GD, G1, G2, G3, G5, G6, G7 |
|
Adhesion Level |
Standard Grade |
Application Guidance |
|
Ultra-low |
GL |
Extremely small, thin and release-sensitive devices |
|
Low |
GD |
Small, lightweight and polished devices |
|
Medium-low |
G1 |
General optical and semiconductor components |
|
Medium |
G2, G3 |
Etched surfaces and moderately weighted components |
|
High |
G5, G6 |
Rougher surfaces and heavier devices |
|
Ultra-high |
G7 |
High-retention applications |
|
Parameter |
Typical Value |
|
Tray size |
2-inch, 4-inch, 6-inch |
|
Mesh |
15, 36, 74, 100, 135, 195 |
|
Grid printing |
1010A, 2020A, 0215A |
|
Adhesion level |
GL, GD, G1, G2, G3, G5, G6, G7 |
|
Adhesion Level |
Standard Grade |
Application Guidance |
|
Ultra-low |
GL |
Extremely small, thin and release-sensitive devices |
|
Low |
GD |
Small, lightweight and polished devices |
|
Medium-low |
G1 |
General optical and semiconductor components |
|
Medium |
G2, G3 |
Etched surfaces and moderately weighted components |
|
High |
G5, G6 |
Rougher surfaces and heavier devices |
|
Ultra-high |
G7 |
High-retention applications |
Secure Handling and Release
Vacuum-release technology secures devices during handling and transport while enabling controlled, low-stress removal.
Secure Handling and Release
GL–G7 adhesion grades accommodate varying device sizes, weights, contact areas, and surface conditions.
Tailored Tray Configuration
Mesh count, tray dimensions, and construction are tailored to device geometry, release behavior, and equipment interfaces.
Configurable ESD Performance
ESD properties are configured according to device sensitivity and specified resistance requirements.
End-to-End In-House Manufacturing
Injection molding, adhesive-film coating, and assembly are performed in-house, enabling tight process control and extensive customization.
Collaborative Custom Engineering
Customization spans molded-part appearance and dimensions, film adhesion, prototyping, pilot production, and volume production.
Optoelectronics
Laser dies · Photodiodes · Modulators
Micro-Optics
Optical filters · Lenses · Mirrors · Prisms
Photonic & IC Dies
Silicon photonics · TIA/driver dies · MEMS · Sensors
Precision Components
Ceramic components · Fiber tips
|
Stage |
Customer Input / Action |
ESTEE Deliverable |
|
1. Requirement Input |
Provide device material, surface roughness, device dimensions, contact area, weight, required tray size, pickup method and ESD requirements. |
Confirmed requirements for protection, release performance, ESD control, and equipment compatibility. |
|
2. Engineering Recommendation |
\ |
Recommended grade, matching mesh count, tray structure and ESD configuration. |
|
3. Sample Validation |
Test samples with actual devices and the intended manual or automated pickup process; verify the effectiveness of holding, release and handling. |
Sample set, validation guidance and any necessary adjustment to film, mesh or tray construction. |
|
4. Pilot and Mass Production |
Approve the validated configuration, drawing/specification and acceptance criteria. |
Small-batch pilot production, issue closure and controlled transition to mass production. |
How Vacuum Release Works
|
Operating State |
Film Condition |
Function |
|
Hold Mode |
The film remains supported in its normal position. |
Provides stable retention during storage, transfer and transportation. |
|
Vacuum Applied |
The film is drawn toward the support mesh. |
Reduces the effective contact area between the device and film. |
|
Pickup / Release |
Holding force decreases rapidly. |
Supports low-stress manual and automated device removal. |
ESTEE provides a precision-device and chip handling and transport solution combining a Grip Ring (Wafer Expander Ring), a protective shipping box and antistatic blue film. The film secures the wafer and singulated die through dicing, expansion and transportation; the ring tensions the film to establish controlled die spacing; and the shipping box locates and protects the loaded ring during storage and shipment.
ESTEE Waffle Packs are precision injection-molded carriers developed for COC optoelectronic chips, die, optical devices, and other miniature precision components. Each device is held in an individual pocket to reduce contact, collision, rotation, and migration during handling, storage, and transportation, while supporting manual handling and automated pick-and-place workflows.
The ESTEE Glue Box is a pocketless carrier with a transparent elastomer layer applied directly to the box base. The continuous support surface securely holds delicate components during storage, shipment, inspection and processing, whilst accommodating both manual handling with tweezers and direct handling by automated pick-and-place equipment.